In Q4 2025, the connector industry is embracing a new wave of growth driven by AI computing power, new energy vehicles (NEVs), and intelligent technologies. From high-speed interconnect solutions to the innovative track of emotional robots, from global layout expansion to accelerated domestic substitution, the industry is witnessing diversified breakthroughs.

I. Industry Trends: Dual-Driven by AI & NEVs, Continuous Iteration of Connection Technologies

1. Surging AI Computing Demand Ignites Explosive Growth of High-Speed Connectors

• Breakthroughs in High-Speed Interconnect Solutions: As a leading connector enterprise, Amphenol ICC-KY has launched  its 800G Active Electrical Cables (AECs), which have entered the supply chain of major international clients and started mass delivery. Meanwhile,  it is collaborating with companies like SENKO to develop integrated optical interconnect solutions, supporting the application of Co-Packaged Optics (CPO) and silicon photonics in large-scale manufacturing.

• Capital-Market Resonance: Sustained strong demand for AI servers is expanding the market scale of high-speed connectors. Amphenol ICC-KY, as the exclusive AEC supplier for Credo (with an over 70% AEC market share), has achieved synchronized rapid business growth.

2. NEVs & Intelligence Drive Innovation in High-Voltage, High-Reliability Connections

• High-Voltage Platforms & Lightweight Needs: TE Connectivity has newly launched its "Inside Device Connectivity" connector series, supporting 45A high current and 180-pin high-density connections. Tailored for core components such as battery management systems (BMS) and advanced driver assistance systems  (ADAS), it meets the compactness and anti-interference requirements of software-defined vehicles (SDVs) and zonal architectures.

• Emergence of Smart Connectors: The Wuhan Automotive Wire Harness Exhibition showcased integrated sensor connectors,      which can real-time monitor plug-in cycles, temperature, and vibration data, and enhance system safety through early warnings.

3. Track Differentiation in Emotional Robots Highlights Demand for Micro-Connectors

• Capital Bets on Emotional Interaction: Shouxing Technology secured funding led by Ant Group. Its emotional base model relies on 26 micro-actuators to achieve millisecond-level facial expression control, placing strict demands on high-density, miniaturized connectors and opening up a new "non-tool-type robot" track.

• Technology Matching Opportunities: Bionic skin and micro-motors require more precise internal connectors, driving the upgrade of connectors toward millimeter-level pitch and high bending resistance.

II. Technology Hotspots: Innovative Patents & Intelligent Manufacturing Advance Hand in Hand

1. Signal Stability & Cost Optimization

Weifeng Electronics recently obtained an invention patent for "a signal-stable connector." Its hard interference design between metal sleeves and claw springs improves electrical contact stability, eliminating the need for expensive coatings and achieving cost reduction while enhancing efficiency.

2. Intelligent Production Empowers Quality Upgrade

At the Wuhan Wire Harness Exhibition, fully automated wire harness production lines equipped with AI visual inspection systems increased the accuracy of terminal crimp defect detection to 0.1mm and controlled the defect rate below 0.05%, significantly improving manufacturing consistency.

3. Breakthroughs in Opto-Electrical Integration & Thermal Management

The IMPACT 2025 Seminar focused on "energy-efficient AI," where enterprises like TSMC and Intel emphasized the importance of CPO and glass substrates in high-speed interconnections. Connectors are required to support higher bandwidth and heat dissipation efficiency.

III. Industry Events Roundup: Q4 Exhibition & Conference Guide

IV. Global Pattern: Challenges & Opportunities Under "Dual-Track Drive"

• Accelerated Layout of Southeast Asian Manufacturing Bases: Enterprises such as AVIC Optoelectronics and Deren Electronics have built factories in Vietnam, focusing on PV and automotive connectors to serve regional markets and avoid trade barriers.

• Domestic Substitution Moves Toward High-End Segments: Huguang Co., Ltd.’s 800V high-voltage connectors have entered Tesla’s supply chain; Huafeng Technology’s 112Gbps backplane connectors have passed Intel’s certification. Domestic technologies now show significant competitiveness in the international market.

V. Outlook: The Future Path of the Connector Industry

• Short-Term: Demand for AI servers and NEVs will continue to drive the growth of high-speed and high-voltage connectors.

• Mid-to-Long-Term: Technologies such as emotional robots, glass substrates, and silicon photonics will spawn new  connection solutions. Enterprises need to advance layouts in miniaturization, opto-electrical integration, and material innovation.

• Ecosystem Construction: Promote industry collaboration through exhibitions and technical seminars (e.g., Dongguan Super Node Interconnect Conference) to drive standard-setting and industrial chain synergy.

Connectors have evolved from basic components to core hubs of intelligent systems. Driven by globalization and technological innovation, enterprises must keep pace with cutting-edge tracks such as AI, NEVs, and emotional interaction, and unlock a new chapter of growth through technological breakthroughs.

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